CD4148WP features ? silicon epitaxial planar diode ? smd chip pattern, available in vari ous dimension included 0805 & 0603 ? leadfree and rohs compliance components mechanical characteristics ? size: 1206 ? weight: approx. 10mg ? marking: cathode terminal dimensions dimension/mm 1206 l 3.20.2 w 1.50.2 t 0.850.1 c 0.550.2 thermal characteristics 1) parameter at t amb =25 o c 1) symbol value unit 400 mw forward power dissipation power derating above 25 o c p tot 3.2 mw/ o c junction temperature t j 150 o c thermal resistance junction to ambient air r ja 375 o c/w operating& storage temperature range t stg -55 to 150 o c 1) valid provided that electrodes are kept at ambient temperature. small signal switching diode www.shunyegroup.com.cn
maximum rating 1) parameter at t amb =25 o c 1) symbol value unit repetitive peak reverse voltage v rrm 75 v average rectified current sin half wave rectification with resistive load i f(av) 150 ma repetitive peak forward current at t amb =25c i frm 300 ma non-repetitive surge forward current at t<1s and t j =25 o c 500 ma at t Q 8.3ms and t j =25 o c i fsm 1000 ma 1) valid provided that electrodes are kept at ambient temperature. electrical characteristics 1) parameter at t amb =25 o c 1) symbol value unit forward voltage at i f =10ma 1.0 max v at i f =100ma v f 1.25 max v leakage current at v r =20v 0.025 max ua leakage current at v r =75v i r 5 max ua capacitance at v r =0v, f=1mhz c tot 4 max pf reverse recovery time at i f =i r =10ma,r l = 100 t rr 4 max ns 1) valid provided that electrodes are kept at ambient temperature. typical characteristics figure 1. forward characteristic figure 2. power de-rating 0 100 200 300 400 500 0 20 40 60 80 100 120 140 160 180 200 tamb-ambient temperature/oc ptot-admissible power dissipation/ mw www.shunyegroup.com.cn
figure 3. forward current d e- rating figure 4. reverse voltage de-rating 0 100 200 300 400 500 0 20 40 60 80 100 120 140 160 180 200 tamb-ambient temperature/oc if/ ma . 0 50 100 150 200 0 20 40 60 80 100 120 140 160 180 200 tamb-ambient temperature/oc vr/ v . test characteristics test item test condition requirement solderability sn bath at 2455 o c for 20.5s >95% area tin covered resistance to soldering heat sn bath at 2605 o c for 102s v f ,v r & i r within spec; no mechanical damage humidity steady state at 85 o c 85%rh for 168hrs v f ,v r & i r within spec continue forward operating life at 25 o c i f =1.1i f for 1000hrs v f ,v r & i r within spec thermal shock -55 5 o c/5min to 1505 o c/5min for 10cycles v f ,v r & i r within spec bending strength bending up to 2mm for 1cycle v f ,v r & i r within spec; no mechanical damage www.shunyegroup.com.cn
applications ? function: fast switching, suit for small signal switching application ? soldering condition: soldering condition & caution recommended soldering condition (refer to ipc/jede c j-std-020d 4-1&5.2) recommended profile condition sn-pb soldering leadfree soldering wave soldering ramp-up rate (from pre-heat stage) <3 o c/s <3 o c/s t<150 o c pre-heat temperature & time 100-150 o c 60-120s 150-200 o c 60-120s 100-150 o c 60-120s soldering temperature & time 183 o c 60-150s 217 o c 60-150s 2605 o c 52s peak temperature 2305 o c <260 o c 2455 o c <260 o c 2605 o c time within 5 o c of peak temperature 10-20s 20-30s - ramp-down rate <6 o c/s <6 o c/s <6 o c/s time 25 o c to peak temperature <6min <8min - manual soldering: approx. 350 o c for 3s, avoid solder iron tip di rect touch the components body recommended soldering profile fig1: reflow soldering profile for lead-free solder (snagcu) t/s t/ o c www.shunyegroup.com.cn
fig2: wave soldering profile *1. the recommended profiles are referring to ipc/jedec j-st d-020d & iec-60068-2-58 *2. chip diodes are able to stand maximum soldering temperature up to 260 o c max for 10s, and the soldering cycles with max 3 ti mes, referring to iec-60068-2-58 ? recommended soldering footprint: reflow/wave soldering dimension/ mm product size a b c d 1206 3.8-4.6 2.2 0. 8-1.2 1.5-1.7 t/s t/ o c www.shunyegroup.com.cn
? storage condition: product termination solderability can degrade due to high temperature and humidity or chemical environment. storage condit ion must be in an ambient temperature of <40 o c and ambient humidity of <75%rh, and free from chemical. environmental characteristics hazardous substance or element/ppm pb cd hg cr 6+ pbb pbde product <1000 <100 <1000 <1000 <1000 <1000 halogen substance/ ppm f cl br i total product <900 <900 <900 <900 <1500 packing method quality/reel reel size tape product 5,000pcs 7? paper www.shunyegroup.com.cn
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